View Original Size
Features:
1. Intelligent Desoldering, Reflow, Degumming, Layering, Lamination, Tin Planting, Welding Mobile Phone Curve Heating Tool.
1. 3.4inch Screen Display Monitor temperature changes and realize reflow soldering temperature curve data monitoring.
2. Turbofan blades for heat dissipation, built-in strong wind cooling system.
3. Adopted new MCH ceramic double heating element is adopted, the platform has faster heating, more uniform temperature, and stable performance.
4. 5 professional mode selection, 3 common mode operation.
Description:
1. Reflow Soldering Preheating Platform is designed for the original solder of mobile phone motherboard, curve heating, intelligent and safe desoldering and reflow.
2. 5 application scene modes: degumming, layering, lamination, tin planting, and welding.
3. 3 commonly used memory temperatures, automatic recording of the current temperature and manual recording of the current temperature mode.
4. Suits for: Phone X/XS/XS Max/11/11 Pro/11Pro Max/12 Mini/12/12 Pro/12Pro Max/13 Mini/13/13 Pro/13Pro Max
