Optional high temperature heating holder base :
Option 1: for Phone 6-7P Motherboard
Option 2: for Phone X Double Layers Board ( with double-groove)
Option 3: for Phone X Board Disassembly
Setting parameters (Temperature) :
Take apart screen cover 180℃-220℃
CPU edge glue 180℃-220℃
Take off A8 A9 A10 CPU 230℃-240℃
Desmearing 180℃-200℃
Reball BGA chip 180℃-200℃
Soldering A8 A9 A10 CPU 190℃-210℃