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Mechanic Mag Tin chip tin planting platform for Phone. Mechanic magnetic levitation chip tin planting platform with stencil for Phone Qualcomm IC CPU Nand flash fonts reballing soldering. MECHANIC Mag Tin positioning Tin Planting reballing steel mesh for Phone
Features:
1. Strong Magnetic: According to the principle of magnetic levitation.
2. Automatically adsorbed and clamped the steel stencils.
3. Infinite Update: For all BGA chip tin planting, constantly updated.
4. Steel Stencils Set: Phone series, Huawei series, Qualcomm series.
5. Premium imported: High temperature resistance of 500°C no deformation or bulging 6. Made of AAAA grade steel, good flexibility.
7. Magnetic Module: Fix the chip in the upper left corner of the chip groove.
8. Make the magnetic module withstand the edge of the chip automatically. It can cover the corresponding chip stencil.
