Qianli IP-01 02 BGA Ball Mounting Platform

QianLi ToolPlus iP-01 iP-02 Middle layer frame BGA reballing stencil platform for Phone X XS XS MAX 1 Pro MAX motherboard repair, ToolPlus iP-01 iP-02 Phone middle layer planting tin soldering fixture, Qianli 3D BGA reballing metal stencil motherboard middle frame planting tin reballing platform for Phone logic board repair net fixture

Features : 

Durable, unique design

Seiko, featured material

Precise positioning

Efficiency Improvement

Strong magnetic attraction

Stencils won't deform under high temperature

High quality Phone Middle frame Reballing Platform

BGA Reballing Platform for Phone X/XS/XS MAX/11/11 Pro/11 Pro MAX.

Make your repair work easier