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MECHANIC iBGA 14 Middle Layer Positioning Tin Planting Platform Stencil Suit Support for iPhone iPhone 14/14Plus/14Pro/14Pro Max Motherboard.
Features:
- Supports iPhone 14/14 Plus/14 Pro/14Pro Max intermediate main board planting tin.
- Automatic positioning function, embedd strong magnetic adsorption, precise alignment position without offset.
- import special steel material, high temperature resistance 500 °C, no bulge, no deform.
- Can be planted tin off the net and integrated molding, use a heat gun to heat and blow until the solder paste melts.
1 x Tin-planting platform
2 x Steel mesh
