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Applicable Model:
1. For iPhone 6-14 Pro Max CPU (A8 A9 A10 A11 A12 A13 A14 A15 A16 CPU).
2. For Huawei HI3670, Huawei HI3680, HiSilicon HI3690, HiSilicon HI3690 5G, HiSilicon HI6290/L, Qualcomm SM8250-102 small, Qualcomm SM8250-202 large, Qualcomm SM8350/Snapdragon 888, Snapdragon 845/SDM845, Snapdragon 855/SM8150, Kirin 9000 HI36A0, EMMC/EMCP/UFS BGA153.
Option:
1. Z21 MAX for iPhone.
2. Z21 MAX for Android.
3. Z21 MAX for iPhone and Android
Features:
1. High-temperature resistance and abrasion resistance.
2. imported alloy steel, metal fatigue resistance, make the product more durable.
3. Dirt-resistant, easy to clean.
4. High precision, Precise alignment Each mesh is calibrated according to the original factory drawings to ensure the accuracy of the solder joints.
5. The square holes and rounded corners are planted with tin and black nets to make each of your tin balls more rounded and fuller.
6. Rigid and flexible, maintaining the flexibility of the steel, normal deformation and bending can be easily restored to its original shape.
7. High precision, no burrs, so that every mesh can be of the same size and not stuck.
8. Double magnet, super magnetic, accurate positioning without shaking.
