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MJ K35 Tin Planting Platform For iPhone 12 Mini PCB Soldering Repair

MJ K35 Tin Planting Platform For iPhone 12 Mini PCB Soldering Repair
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FOB Price: 20.00 USD/piece  
Product Type: BGA Reballing Platform 
Port: shenzhen 
Minimum Order Quantity: 1 piece 
Supply Ability: 1000000 piece
Place Of Origin: CHINA
Delivery Time: 7 days
Expiry Date: long-term effectiveness
Last Update: 2023-08-21
Views: 10
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Product Details
 
Mijing K35 tin planting platform with BGA reballing stencil for iPhone 12 Mini 12 Pro Max logic board soldering repair, MJ K35 metal BGA reballing stencil for iPhone 12 12 Mini 12 Pro 12 Pro Max BGA PCB welding repair.

Mijing K35 Logic Board Soldering Holder Fixture For iPhone 12 12 Mini 12 Pro Max PCB Welding Repair

Product Features :
  1. Install the iPhone 12/12 Mini/12 Pro/12 Pro Max main board on the platform
  2. Cover the iPhone 12/12 Mini/12 Pro/12 Pro Max BGA reballing stencil on mainboard
  3. Evenly spread tin on the cover of the reballing stencil
  4. Remove the reballing stencil cover
  5. Take out the motherboard and cooperate with the hot air gun to solidify the tin point.

Product Specification :
  • Item Name: MJ K35 Tin Platform
  • Brand: MiJing
  • Model: K35
  • Material: imported synthetic stone material
  • Color: Blue + Silver
  • Size: 120*115*20mm
  • Weight: 350g
  • Suit For: iPhone 12/12 Mini/12 Pro/12 Pro Max
  • Application: For iPhone 12/12 Mini/12 Pro/12 Pro Max motherboard upper / lower layers logic board soldering repair.


Packing Includes :

  • 1pc x MJ K35 Tin Platform
 
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