Qianli IP-01 02 3D iPhone X-11 BGA Middle Frame Planting Tin Platform

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FOB Price:	19.00 USD/piece
Product Type:	BGA Reballing Platform
Port:	shenzhen
Minimum Order Quantity:	1 piece
Supply Ability:	1000000 piece
Place Of Origin:	CHINA
Delivery Time:	7 days
Expiry Date:	long-term effectiveness
Last Update:	2023-08-24
Views:	13

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Product Details

QianLi ToolPlus iP-01 iP-02 Middle layer frame BGA reballing stencil platform for iPhone X XS XS MAX 11 Pro MAX motherboard repair, ToolPlus iP-01 iP-02 iPhone middle layer planting tin soldering fixture, Qianli 3D BGA reballing metal stencil motherboard middle frame planting tin reballing platform for iPhone logic board repair net fixture

QianLi ToolPlus iP-01 iP-02 BGA Reballing Platform for iPhone X-11 Pro Max Logic Board Dissembling and Assembling Testing Tool

[ Optional BGA Platform ] :

Option 1: QianLi ToolPlus iP-01 for iPhone X/XS/XSMax
Option 2: QianLi ToolPlus iP-02 for iPhone 11/11Pro/11Pro Max

Features :

Durable, unique design
Seiko, featured material
Precise positioning
Efficiency Improvement
Strong magnetic attraction
Stencils won't deform under high temperature
High quality Phone Middle frame Reballing Platform
BGA Reballing Platform for iPhone X/XS/XS MAX/11/11 Pro/11 Pro MAX.
Make your repair work easier

Specification :

Material: metal
Color: Gray
Size: 99mm * 60mm * 15mm

How to use :
Step 1 : Put the mainboard into the tin-planting card slot
Step 2 : Align the corresponding tin planting mesh with the right position
Step 3 : Put the solder paste into the stencil by scraper
Step 4 : Using hot air gun to blow solder paste until it melts

Package included :