| Make foodmate.com your Homepage | Wap | Archiver
Advanced Top
Search Promotion
Search Promotion
Post New Products
Post New Products
Business Center
Business Center
 
display new productsCurrent Position: Home » Selling Leads » Others »

WL Universal BGA Reballing Stencil Positioning Mold for iPhone

WL Universal BGA Reballing Stencil Positioning Mold for iPhone
View Original Size
FOB Price: 6.00 USD/piece  
Product Type: BGA Reballing Platform 
Port: shenzhen 
Minimum Order Quantity: 1 piece 
Supply Ability: 1000000 piece
Place Of Origin: CHINA
Delivery Time: 7 days
Expiry Date: long-term effectiveness
Last Update: 2023-08-25
Views: 10
inquiry
about us






 
 
Product Details
 
WL High-Quality Universal Repair Holder for CPU NAND Baseband Tin Plate Steel Net BGA Reballing Stencil Positioning Mold with Fixed Plate.

Description:
  • WL BGA Reballing Stencil Positioning Mold for WL BGA Reballing Stencil
  • Universal Aluminum Mould Base for WL 0.1mm BGA Reballing Stencil
  • Magnetic cell phone BGA reballing stencil positioning mold for BGA Chip repair
  • Compatible with: iPhone 5 5C 5S 6 6S 6P 6SP 7 7P / A6 A7 A8 A9 A10

Package included:
  • 1pc x Holder
 
Contact to this supplier
0 in all [view all]  Related Comments
 
more..Other Products from this Supplier

[ Selling Leads search ]  [ ]  [ Notify friends ]  [ Print ]  [ Close ]

 
 
Processed in 0.065 second(s), 12 queries, Memory 0.94 M
Powered by Global FoodMate
Message Center(0)