Description:
- WL BGA Reballing Stencil Positioning Mold for WL BGA Reballing Stencil
- Universal Aluminum Mould Base for WL 0.1mm BGA Reballing Stencil
- Magnetic cell phone BGA reballing stencil positioning mold for BGA Chip repair
- Compatible with: iPhone 5 5C 5S 6 6S 6P 6SP 7 7P / A6 A7 A8 A9 A10
Package included:
- 1pc x Holder