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MECHANIC iBGA BGA Reballing Positioning Platform for iPhone repair

MECHANIC iBGA BGA Reballing Positioning Platform for iPhone repair
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FOB Price: 38.00 USD/piece  
Product Type: BGA Reballing Platform 
Port: shenzhen 
Minimum Order Quantity: 1 piece 
Supply Ability: 1000000 piece
Place Of Origin: CHINA
Delivery Time: 7 days
Expiry Date: long-term effectiveness
Last Update: 2023-08-28
Views: 12
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Product Details
 
MECHANIC iBGA Max 6 in 1 automatic positioning tin-planting platform for iPhone X- 11 Pro MAX phone BGA PCB middle layer repair. Mechanic iBGA Max 6 in 1 mid-level automatic positioning tin planting platform, Mechanic iBGA Max 6 in 1 positioning tin planting platform, Support for iPhone X /XS / XS MAX / iPhone 11 / 11 Pro MAX.

iBGA MAX 6 in 1 
A new generation of "MECHANIC strong magnetic automatic positioning tin platform iFixture X", the tin repair strength to a new level, MECHANIC exquisite technology is an uncompromising quality.

Product Features : 
  1. Double-sided Self-positioning Design: Support For iPhone X/XS/XS MAX/11/11 PRO MAX
  2. Strong Magnetic Suction Steel Stencil: Make the stencil and welding precise fitting scraping tin ball easier
  3. Leak-proof Tin Design: To prevent the tin paste dropped on other parts, Effectively protect the motherboard of mobile phones.
  4. Embedded Strong Magnetic Adsorption: Automatic positioning, No offset, Accurate and fast, So that maintenance work en-ciency is higher.

Product Specification : 
  • Model: Automatic positioning tin-plating platform for the mid-level motherboard
  • Item name: iBGA Max
  • Size: 97*76*20mm
  • N.W.: 300g
  • G.W.: 380g
  • Scope of Application: Perfect iPhone X/XS XS MAX/11/11 Pro/11 Pro Max motherboard box RF small board positioning, Tin-plating repair application.

Package includes : 
  • 1 Set Tin-plating Platform
 
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