Metal Bond Grinding Wheels For Thinning Sapphire Polycrystalline Silicon Monocrystalline Silicon

metal Bond Diamond/CBN Grinding Wheels used for back side thinning and front side fine precision grinding of silicon wafer. Our grinding wheels are with superior performance and high cost performance, it can meet the top level requirement among the world. It can highly decrease the material loss of the sapphire, poly crystalline silicon and mono crystalline silicon, silicon ingots, etc.